Dry lift-off technology for electrooptic polymer thin films and its photonic device applications

摘要

We report a sacrificial layer based thin film dry lift-off technology capable of transferring large area electrooptic polymer thin films between different substrate platforms. This technology allows integration of electrooptic polymer waveguide devices with high-speed driving circuits that are sensitive to high temperature and intense poling field. It also provides access to both sides of the polymer stack for poling electrodes removal and other special processes. Using the dry lift-off technology, we have successfully fabricated and demonstrated all-dielectric fiber-optic electric field sensors with electrooptic polymer films. Device fabrication and characterization details are presented.