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X-Y scaling compensation technology for fine-line PCB imaging with high-precision alignment

机译:X-Y缩放补偿技术,具有高精度对准的细线PCB成像

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As imaging requirements continue to move towards finer resolution, accurate layer-to-layer alignment becomes an increasingly important factor that influences product yield. One of the major contributors to yield loss in fine-line products is the dimensional instability of the substrate. Large rigid substrates as well as flexible films often undergo slight dimensional changes as a result of the different PWB manufacturing process steps. In addition, the changes in the substrate dimensions are often non-isotropic. Manufacturers have been compensating for this problem by measuring the changes in the substrate and plotting new artwork that is matched to the dimensions of the processed substrate. This time-consuming and costly manufacturing practice can be eliminated through the use of the new Anamorphic X-Y Scaling technology that enables independent magnification compensation in two dimensions for laser projection exposures. In this paper, we present the results of studies conducted on laser projection imaging equipment and specifically review the performance of the X-Y scaling capability.
机译:由于成像要求继续转向更精细的分辨率,准确的层到层对齐成为影响产品产量的越来越重要的因素。细线产品中屈服损失的主要贡献者之一是基材的尺寸不稳定性。大的刚性基板以及柔性薄膜通常由于不同的PWB制造工艺步骤而经历轻微的尺寸变化。另外,衬底尺寸的变化通常是非各向同性的。通过测量基板的变化并绘制与加工基板的尺寸匹配的绘制的新艺术品,制造商已经补偿了该问题。通过使用新的变形X-Y缩放技术,可以消除这种耗时和昂贵的制造实践,该技术可以在两个尺寸中实现激光投影曝光的两个维度。在本文中,我们介绍了在激光投影成像设备上进行的研究结果,并具体介绍X-Y缩放能力的性能。

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