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ON THE ZERO OFFSET STABILITY OF THICK FILM STRAIN GAUGES

机译:厚膜应变仪的零偏移稳定性

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This paper presents results of work aimed at characterising the zero offset stability in novel thick film strain gauges. Some theories are presented to explain the apparent lack of repeatability exhibited by thick film strain gauges when they are subjected to cycling of load or temperature. The devices studied are z-axis (k{sub}33) load sensors fabricated on insulated stainless steel substrates and include examples of novel commercially developed force sensors. Devices loaded with compressive strains using a purpose designed test jig were found to exhibit a significant zero offset shift, which is negative up to a certain level (typically 1000 micro strains) and then increasingly positive when strained beyond this point. Repeated cycles of loading then produced a certain level of stability until the previous maximum value of applied strain was exceeded. The gauge factors of the devices exhibited a strong inverse dependence on applied strain and apparent super high gauge factors of up to 250 or more were obtained at low levels of strain. Temperature coefficient of resistance (TCR) measurements showed the devices to exhibit characteristics that depend significantly on the device geometry. The TCR was found to increase positively with increasing device thickness and surface area. The effect of overglazing the devices was found to decrease the TCR. In general the TCR of thick film resistors on stainless steel substrates exhibit positive TCRs at room temperature. However, it was noted that if a device was thin, had a sufficiently small surface area and was overglazed, then the TCR could exhibit a negative value at room temperature.
机译:本文提出了旨在表征新型厚膜应变仪中零偏移稳定性的工作的结果。提出了一些理论以解释当它们对负载或温度循环循环时厚膜应变仪表现出的明显缺乏可重复性。研究的装置是Z轴(k {亚} 33)在绝缘不锈钢基板上制造的负载传感器,包括新颖的商业发育力传感器的示例。发现使用目的设计的测试夹具装载压缩菌株的装置表现出显着的零偏移偏移,这对于一定的水平(通常为1000微株),并且在紧张超出这一点时越来越积极。重复循环的加载循环然后产生一定水平的稳定性,直到超过了应用菌株的最大值。该器件的仪表因子表现出对应用应变的强烈逆依赖性,并且在低水平的菌株中获得了高达250或更高的表观超高量仪表。电阻温度系数(TCR)测量显示了装置,以表现出显着依赖于器件几何形状的特性。发现TCR随着器件厚度和表面积的增加而正呈呈正增加。发现覆盖器的效果降低了TCR。通常,不锈钢基板上的厚膜电阻的TCR在室温下表现出阳性TCR。然而,注意到,如果装置薄,则具有足够小的表面积并且覆盖物覆盖,然后TCR可以在室温下表现出负值。

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