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A PROCESS FOR THE PREPARATION OF AN IMPROVED THICK FILM RESISTOR USEFUL FOR MAKING STRAIN GAUGE WITH ENHANCED GAUGE FATOR UPTO 1000
A PROCESS FOR THE PREPARATION OF AN IMPROVED THICK FILM RESISTOR USEFUL FOR MAKING STRAIN GAUGE WITH ENHANCED GAUGE FATOR UPTO 1000
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机译:改进的厚膜电阻器的制备过程,该电阻器可用于使用最大至1000的增强型量规来制作应变仪
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摘要
A process for the preparation of an improved thick film resistor useful for making strain gauge with enhanced gauge factor upto 1000, which comprises: a] cleaning and insulating substrate [1] capable of withstanding high temperature by known methods; b] coating the said cleaned substrate by known method with a known non-corrosive conductor thick film [2] of thickness about 10 to 20 microns; drying the coated substrate [1,2] at temperature in the range of 60 to 120°C for 15 minutes; c] coating by known method the thus prepared substrate [1,2] with a known resistor thick film [3] of thickness of about 15 to 20 microns, drying the coated substrate [1, 2, 3] at temperature in the range of 60 to120°C for about 10 to15 minutes; d] coating by known method the resistor thick film [3] with cyanometallic compound [4] of thickness in the range of 10 to 25 microns; drying the coated substrate [1, 2, 3, 4] at temperature in the range of 60 to120°C for about 10 minutes; e] firing the thus prepared substrate [1, 2, 3, 4] to a temperature in the range of 800 to 900°C for a period ranging 10 to 20 minutes to obtain an improved thick film resistor useful for making strain gauge with enhanced gauge factor upto 1000.
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