A CERAMIC BGA148 PACKAGE FOR ASSEMBLY OF A 2 GSPS ANALOG TO DIGITAL CONVERTER

摘要

This paper presents the package designed for the assembly of a high performance 10 bit 2 Giga Sample per second (Gsps) Analog to Digital Converter dissipating near 5 Watts. The package is a Ceramic Land Grid Array with 148 Eutectic SnPb balls and houses the Silicon 3.8×3.8 mm ADC die. The die, which is in SiGe process using 3 metal layers, is interconnected to the LGA using conventional wire bonding method.