Compressively stressed tungsten films deposited upon ductile films can generate delamination of the underlying films. As the thickness and stress are varied using different sputtering conditions, the morphology of the delamination can change. A film system of tungsten on silica was used to validate the stressed overlayer method of film delamination. Overlayer films with a high compressive stress (1-2GPa) spontaneously buckled forming telephone cord and straight buckles. The interfacial fracture toughness and phase angle of loading were calculated using both telephone and straight buckles. The stressed overlayer method was shown to be a valid technique to determine the interfacial toughness of the tungsten/silica system.
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