Advances in light curing adhesives

摘要

This paper describes the development of a new family of light curing adhesives containing a new reactive additive previously not used in optical grade light curing adhesives. High performance properties, such as high T{sub}g, previously not associated with light curing adhesives are obtained with the addition of functionalized cellulositics. Outgassing as low as 10{sup}(-6) grams/gram has been observed based on headspace sampling. Other additives have lowered the shrinkage rates of positioning (edge bonding) adhesives from near 1% to less than 0.1% with fractional percentage movements over thermal range of-40°C to + 200°C.