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Electrodeposition of Semiconductor n-CdTe and p-CdTe in Aqueous Medium and Aluminum metal in a Nonaqueous Medium

机译:在非水介质中含水介质中半导体N-CDTE和P-CDTE的电沉积

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Both n-type and p- type semiconductor CdTe were synthesized by electrodeposition from an aqueous deposition bath. Electrodeposition potential was found to be the key factor to synthesize the CdTe semiconductor of any specific conductivity type. The electrodeposition potentials of -0.4 V and 0.4 V versus Ag/AgCl generated the p-type and n-type CdTe respectively. The optimum deposition time was found to be 90 minutes for the best photoresponce of CdTe during water-splitting reaction. The indirect band gap energy of CdTe was found tunable from 1.55 to 2.00 eV by controlling both electrodeposition potential and the annealing time. Crystalline aluminum metal was deposited on a platinum electrode tip at room temperature in a non-aqueous deposition bath of anhydrous toluene containing aluminum bromide and the supporting electrolyte, tetra butyle ammonium bromide. Anhydrous condition was found to be the critical factor for the success of electrodeposition and production of aluminum metal at room temperature in a non-aqueous deposition bath.
机译:通过从沉积浴中的电沉积来合成n型和P型半导体CDTE。发现电沉积电位是合成任何特定导电类型的CDTE半导体的关键因素。 -0.4V和0.4V的电沉积电位分别为P型和N型CDTE。发现最佳沉积时间为90分钟,在水分解反应过程中最佳光散料。通过控制电沉积电位和退火时间,发现CDTE的间接带隙能量从1.55到2.00eV调谐。在含有铝溴化铝的非水沉积浴的室温下在铂电极尖端的铂电极尖端上沉积结晶铝金属,含有铝溴化铝和支撑电解质,Tetra Butyle溴化铵。发现无水状况是在非水沉积浴中在室温下电沉积和铝金属生产的临界因素。

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