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Computer simulation of WSi_x CVD VLSI processing - effect of abnormal inlet gas flows -

机译:WSI_X CVD VLSI处理的计算机模拟 - 异常入口气流的影响 -

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We made two- and three-dimensional computer simulations of tungsten silicide (WSi_x) CVD from tungsten hexafluoride and silane (WF_6/SiH_4) source gases in a cold-wall, single-wafer reactor with the gas introduced through a showerhead using a computational fluid dynamics (CFD) model. We investigated the effect of the following inlet parameters on the radial deposition rate and composition profile: inlet flow through a 2 -mm-wide annular slit in the showerhead, where the flow velocity through this inlet was different from average flow velocity through the showerhead; variable showerhead-to-substrate distance; presence of partially clogged radial gas inlet; and discrete gas inlet hole. We used simulations of the effect of varying each of these parameters to determine the effect of abnormal operating conditions on the film deposition rate and composition profiles. These results demonstrate how CFD simulations can be used to simulate the effect of operating conditions on CVD reactor performance.
机译:我们通过使用计算流体通过喷头引入的气体,从钨六氟化物和硅烷(WSI_x)CVD的两维计算机模拟钨硅烷和硅烷(WSI_X)CVD进行两维计算机模拟,用淋浴头引入的气体动力学(CFD)模型。我们研究了以下入口参数对径向沉积速率和组成型材的影响:入口流过喷头中的2毫米宽的环形狭缝,其中通过该入口的流速与通过喷头的平均流速不同;可变淋浴喷头到基板距离;存在部分堵塞的径向气体入口;和离散的气体入口孔。我们使用模拟改变这些参数的效果,以确定异常操作条件对膜沉积速率和组成轮廓的影响。这些结果表明了CFD模拟如何用于模拟操作条件对CVD反应器性能的影响。

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