The soldering equipment mainly determines the quality of soldering process. Assuring the right temperature is one of the goals imposed by a reliable soldering process. The soldering environment must be controlled to fulfill a lot of requirements. The main issue is to avoid exceeding the maximum admitted absorbed energy (temperature time). On the other side, an insufficient heating (less absorbed energy by the solder joint) does inadequate joints or even unsoldering. The reality offers numerous examples of unsoldered areas caused by lack of energy. The soldering equipments may be ordered according how does their job: asynchrony (making joint after joint) and synchrony, making all joint together. The paper intends to present thermal modeling and simulation of a lot of soldering tools. These equipments will be studied from thermal point of view. The tools will be simulated in a software environment to meet the soldering requirements for a usually application.
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