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Chemical heterogeneities in AA2024: dioxygen reduction as a probe of removal of Cu-rich inclusions VIA chemical etching

机译:AA2024中的化学异质性:DiOxygen通过化学蚀刻作为除去富含Cu的夹杂物的探针

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For light-weight aluminum alloys, such as AA2024, dioxygen reduction at Cu-rich intermetallic inclusions is an important cathodic reaction that can drive corrosion. To better understand this process, electrochemical measurements were used to examine dioxygen reduction at AA2024 samples using a wall jet flow cell. These experiments were done in a potential regime where anodic processes are unimportant. This allows unambiguous measurement of dioxygen reduction currents at the alloy and determination of the influence of various surface treatments on this current. Dioxygen reduction was first studied at untreated alloy surfaces (i.e. surfaces subjected to polishing under aprotic conditions) and then again after subjecting the surfaces to a chemical etchant solution designed to remove Cu from the intermetallic inclusions at the surface of the alloy. these etching solutions contain both an oxidant (persulfate) and a Cu~(2+) complexing agent (diethylene triamine). A significant decrease in the dioxygen reduction current results from exposure of the alloy samples to the etchant solutions. The influence of etching time on this decrease was also studied.
机译:对于轻质铝合金,例如AA2024,Cu的金属间夹杂物的二恶子还原是可以驱动腐蚀的重要阴极反应。为了更好地理解该过程,使用电化学测量来使用壁射流流动细胞检查AA2024样品的二恶子还原。这些实验是在阳极过程不重要的潜在制度中进行的。这允许在合金中明确测量二恶英还原电流,并确定各种表面处理对该电流的影响。首先在未处理的合金表面进行二恶英(即,在非质子条件下进行抛光的表面),然后在使表面进行到旨在从合金表面的金属间夹杂物中除去Cu的化学蚀刻剂溶液之后再次进行。这些蚀刻溶液含有氧化剂(过硫酸盐)和Cu〜(2+)络合剂(二亚乙基三胺)。二氧化降低电流的显着降低导致合金样品暴露于蚀刻剂溶液。还研究了蚀刻时间对这种降低的影响。

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