High Refractive Index and Thermal Stability UV-Curable Novel Inorganic-Organic Acrylate Nanocomposites

摘要

Recently, the development of light-emitting diode (LED) industry in Taiwan has confronted a technical production problem. During the manufacturing process of lumen output LEDs operating at high currents the lack of key materials on packaging generates much waste heat. There is a need to develop an innovative packaging technology to remove such heat. High power LED packaging requires tasks on chip design, die attach, submount design, encapsulation and lead frame design. The packaging materials must be able to enhance the light transmission, reliability and effective duration of a device. In order to achieve those goals, the LED industry has identified three main areas of technological improvements in packaging. The three areas include materials that increase the extraction efficiency of the light from the LED die, optics that improve the extraction of light from the final package and thermal management that reduces the waste heat. If the heat is unable to be removed effectively and LED chips are not kept at a cool temperature, the ultra-high lumen LED arrays will be weakened, causing the duration of LED chips shorten and even fail. The UV-curable multiple functionality acrylate resins mixed with high refractive index TiO2 nanoparticles are therefore proposed and designed to provide solutions . The innovative LED package materials are expected to exhibit high refractive index3 , high thermal stability1 …etc.