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Oligosaccharide/Silicon-Containing Block Copolymers for Nanolithography

机译:用于纳米光刻的含寡糖/硅嵌段共聚物

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The need to overcome feature-size limitations in conventional photolithography has led to interest in block copolymer (BCP) systems, which can produce features on the 1-100nm length scale. 1 BCPs that incorporate an inorganic moiety, such as silicon, into one of the blocks are attractive because they frequently exhibit high χ- parameters2-4 and form a robust oxide mask after reactive ion etching, improving etch contrast 5 . The present paper describes the synthesis and self-assembly of block copolymers composed of naturally-derived oligosaccharides coupled to a silicon-containing polystyrene derivative synthesized by ARGET ATRP. The block copolymers exhibit large χ enabling formation of 5 nm feature diameters, silicon incorporation in one block for oxygen reactive ion etch resistance, and bulk and thin film self-assembly into hexagonally packed cylinders facilitated by a combination of spin-coating and solvent annealing techniques. As observed by SAXS and AFM, these materials exhibit some of the smallest block copolymer features in the bulk and in thin films reported to date.
机译:以克服在传统的光刻特征尺寸的限制的需要已经导致了嵌段共聚物(BCP)系统,它可以产生对1-100nm长度尺度特征的兴趣。 1个过境点掺入的无机部分,例如硅,放入块中的一个是有吸引力的,因为它们通常表现出高χ-parameters2-4并形成反应性离子蚀刻,改善蚀刻对比度5之后的健壮氧化物掩模。本文件描述了合成和自组装耦合到由ARGET ATRP合成的含硅聚苯乙烯衍生物的天然来源的寡糖组成的嵌段共聚物。所述嵌段共聚物显示出大的χ能够形成为5nm特征的直径,硅结合在一个块为氧反应性离子蚀刻性,松厚度和薄膜自组装成由旋涂和溶剂退火技术的组合促进了六边形填充气缸。如通过SAXS和AFM观察到的,这些材料表现出的体积和在迄今报道的薄膜的一些最小的嵌段共聚物的特征。

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