Novel High-K Polymer Composites with in- situ Formed Silver Nanoparticles for Embedded Capacitor Applications

摘要

Novel materials for embedded capacitor applications are in great and urgent demands, for which high dielectric constant (K), low dielectric loss and process compatibility with the PCBs are the most important prerequisites. Polymer composites provide an ideal solution to combine the dielectric or electrical properties of the ceramic or metal fillers, the low-temperature (<250癈) processability and mechanical properties of polymer matrix1-4. For conductor-insulator composite percolative systems with dramatic increase of K close to the percolation threshold, besides the well reported metal/polymer composites2-4, the carbon black (CB)/epoxy composite has also been considered as a candidate material for embedded capacitors due to its ultra-high K at lower filler loading and higher adhesion to the substrates compared to the polymer/ceramic composites5. Despite the extremely high K, the dissipation factor (Df) of carbon black composites is also very high, which implies the high dielectric loss of the system. So the high dielectric loss is one key issue of this system that needs to be addressed for the decoupling capacitor applications.