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Physical modeling of SiC devices based on the optical characterization of their internal electrothermal behavior

机译:基于其内部电热行为的光学特征的SIC器件物理建模

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While the material and process technologies for SiC devices are becoming steadily more mature, the predictive simulation of SiC devices still lacks the availability of accurately calibrated physical device models. Basically it is feasible to adopt the physical models describing silicon devices for the analysis of SiC devices, but it is indispensable to recalibrate the model parameters. A reliable calibration requires measured and simulated data that can be one-to-one related to each other. But while experimental data mostly refer to the terminal behavior of the device under test, simulations can also provide insight into the "innerelectronic" behavior. It is, therefore, desirable to have immediate experimental access also to quantities which are characteristic of the space-and time-resolved internal operation of SiC devices, because these constitute a very detailed and reliable reference for an accurate model calibration. In view of the device physics underlying the electrothermal behavior of devices, the space- and time-resolved electron and hole concentrations as well as the temperature distribution are among the most interesting quantities.
机译:虽然SIC器件的材料和过程技术变得稳定地变得更加成熟,但是SIC器件的预测模拟仍然缺乏精确校准的物理设备模型的可用性。基本上采用描述硅装置的物理模型来分析SIC器件是可行的,但重新校准模型参数是必不可少的。可靠的校准需要测量和模拟数据,其可以是彼此相关的一对一。但是,虽然实验数据大多是指被测设备的终端行为,但模拟还可以提供对“内电子”行为的洞察力。因此,希望立即进行实验访问,该等数量也是SiC器件的空间和时间分辨内部操作的特征,因为这些构成精确模型校准的非常详细和可靠的参考。鉴于设备的电热行为底层,空间和时间分辨的电子和空穴浓度以及温度分布是最有趣的数量。

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