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Thermal conductivity of Ultrananocrystalline Diamond/Hydrogenated Amorphous Carbon Composite Films Prepared by Coaxial Arc Plasma Deposition

机译:通过同轴弧等离子体沉积制备的超晶金刚石/氢化非晶碳复合膜的导热系数

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The thermal conductivity of ultrananocrystalline diamond/hydrogenated amorphous carbon composite films prepared by coaxial arc plasma deposition (CAPD) was measured by a time-domain thermoreflactance method. The specific heat and density of the films were measured to be 0.891 J/g·K and 1.70 g/cm~3, respectively, as parameters for the estimation of the thermal conductivity. Based on them, the thermal conductivity was estimated to be 2.32 W/m·K. This value is smaller than that of general UNCD/a-C:H films prepared by chemical vapor deposition (CVD). It might be because the CAPD films possesses a huge number of grain bound-aries owing to extremely small grains of approximately 2.3 nm as compared with those of CVD films and its structure enhances phonon scattering.
机译:通过时域热直流法测量通过同轴弧等离子体沉积(CAPD)制备的超晶金刚石/氢化非晶碳复合膜的导热率。测量膜的比和密度分别为0.891J / g·K和1.70g / cm〜3,作为估计导热率的参数。基于它们,估计导热率为2.32W / m·k。该值小于化学气相沉积(CVD)制备的通用UNC值/ A-C:H膜的值。它可能是因为与CVD薄膜的极小颗粒相比,CAPD薄膜具有大约2.3nm的大约2.3nm的晶粒,并且其结构增强了声子散射。

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