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CHARACTERIZATION OF POLYSILSESQUIOXANE BASED LOW-K DIELECTRICS

机译:基于PolySilsesquioxane的低k电晶的表征

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Structural characterization of polysilsesquioxanes was conducted using IR spectroscopy. It was found that hydrogen and phenyl silsesquioxane polymers exhibit more symmetric ring structure compared to that for methyl silsesquioxane before curing and structural transformation occurs as increasing the cure temperature. The onset temperature of structural transformation is highly dependent on the organic group R. In addition, IR and NMR analysis show that the preparation condition of silsesquioxane polymers has a significant effect on the chemical structure, functionality and molecular weight. Variation in mechanical properties of polysilsesquioxane was also examined as a function of curing time, temperature and molecular weight using TBA, nanoindenter and microvicker test.
机译:使用IR光谱进行多晶硅淀粉的结构表征。发现氢和苯基倍半硅氧烷聚合物与甲基倍半硅氧烷相比表现出更多对称的环结构,并且在固化之前,在增加固化温度时发生的结构转变。结构转化的起始温度高度依赖于有机基团R.此外,IR和NMR分析表明,倍半硅氧烷聚合物的制备条件对化学结构,官能度和分子量具有显着影响。还使用TBA,纳米茚,微纤维检测检测多晶硅碳酸硅氧烷的机械性能的变化作为固化时间,温度和分子量的函数。

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