Next generation microelectronic packaging requirements are driving the need to produce increasingly lower dielectric constant materials while maintaining high thermal stability and ease of processing. Polymer candidates with exceptionally low dielectric constant (2.0-2.4), high thermal stability (degradation temperature higher than 400 C), high glass transition temperature (greater than 350 C), low water uptake (less than one percent), solubility in selected organic solvents, low thermal expansion coefficient and the capability for undergoing some unique post-polymerization chemistry to impart insolubility after processing have been successfully synthesized and characterized by our research group.
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