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Characterization of slurry system and suppression of oxide erosion in aluminum CMP (chemical-mechanical planarization)

机译:铝CMP浆料系统抑制浆料系统及氧化物腐蚀的特征(化学 - 机械平面化)

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In this work, we investigated the dependence of the removal rate upon the oxidizer (peroxide) addition into commerically available slurries for a variety of films such as aluminum, titanium,titanium nitride and oxide. We found that the barrier layer materials were extremely sensitive to the peroxide addition while the removal rate varied only slightly for aluminum and oxide. The selectivity to titanium and titanium nitride drops from as high as 1000 to almost close to 1 as the mixture ratio (peroxide: slurry) increases. We proposed that the barrier layer be used to protect the oxide from being over-exposed and suppress the erosion eventually. This can be easily realized by dividing the process into two steps with each step being run at a specific peroxide mixture ratio. The experimental result unambiguously proved, for the first time, the effectiveness of this approach.
机译:在这项工作中,我们研究了去除率在氧化剂(过氧化物)上的依赖性加入到多种薄膜,例如铝,钛,氮化钛和氧化物中的多种膜中。我们发现阻挡层材料对过氧化物的添加极其敏感,而去除速率仅为铝和氧化物而变化。作为混合比(过氧化盐:浆料)增加,对钛和氮化钛的选择性从高达1000降至1℃至几乎接近1。我们提出,阻挡层用于保护氧化物过度暴露并抑制侵蚀最终。通过将工艺除以两个步骤以特定的过氧化物混合物比率运行来容易地实现这一点。实验结果明确证明了这种方法的有效性。

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