首页> 外文会议>Symposium on plasma deposition and treatment of polymers >MAGNETRON SPUTTERED Ti-BASIS HARD MATERIAL COATINGS ON THERMOPLASTIC POLYMERS FOR APPLICATIONS IN PARTICLE SENSITIVE ENVIRONMENTS
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MAGNETRON SPUTTERED Ti-BASIS HARD MATERIAL COATINGS ON THERMOPLASTIC POLYMERS FOR APPLICATIONS IN PARTICLE SENSITIVE ENVIRONMENTS

机译:磁控溅射TI基于热塑性聚合物的硬质材料涂层,用于粒子敏感环境中的应用

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Even under demanding environments, like clean rooms, polymers are already used in different ranges of applications. The wear and particle generation within a specific particle size even under mechanical stress is a limiting factor. So it was the aim to develop an innovative material concept, that enables to apply a thermoplastic polymer coated with a thin hard material (thickness up to 2.5 μm), which also prevents for electrostatical discharges and is usable for complex bodies. Therefore it was necessary to improve the wear resistance and the adherence between the polymer and the coating. To take also economic aspects into consideration a two step production process sequence was required, consisting of the injection moulding process and then the plasma deposition process including a plasma pre-treatment. In this investigation, poly(butylene-terephthalate) (PBT) and poly(amide) 6.6 (PA) and polycarbonate (PC) were chosen as substrate material. The coating materials used, which were mainly deposited by Magnetron Sputter Ion Plating (MSIP), were on titanium basis (Ti-N). To get detailed chemical information about the coatings and the interfacial region they were analyzed by X-Ray Photoelectron Spectroscopy (XPS), additionally Secondary Ion Mass Spectrometry (SIMS) experiments were carried out to confirm the results. The process parameter's influence on the microstructure, which extend from amorphous to columnar (crystalline), and the film thickness were analyzed by SEM. It will be shown and discussed, that it is possible to improve the coating's adherence by plasmapre-treatment as well as to reduce the particle generation after a suitable etching and coating process.
机译:即使在苛刻的环境下,如干净的房间,聚合物已经用于不同的应用范围。即使在机械应力下,特定粒径内的磨损和颗粒也是限制因子。因此,它是开发一个创新的概念材料,能够使施加涂覆有薄硬质材料的热塑性聚合物的目的(厚度可达2.5微米),这也防止了静电的放电,并且是复杂的机构使用。因此,有必要改善聚合物和涂层之间的耐磨性和粘附性。考虑到经济方面,需要两步生产过程序列,由注射成型过程组成,然后包括等离子体沉积过程包括等离子体预处理。在该研究中,选择聚(对苯二甲酸丁二醇酯)(PBT)和聚(酰胺)6.6(PA)和聚碳酸酯(PC)作为底物材料。使用的涂层材料主要由磁控溅射离子电镀(MSIP)沉积在钛基(Ti-N)上。为了获得有关涂层的详细化学信息和通过X射线光电子能谱(XPS)分析它们的界面区域,还进行次级离子质谱(SIMS)实验以确认结果。通过SEM通过SEM分析从非晶延伸到柱状(结晶)的微观结构的过程参数的影响。通过SEM分析膜厚度。将显示和讨论,可以通过Plasmapre治疗改善涂层的粘附以及在合适的蚀刻和涂覆过程之后降低颗粒产生。

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