Silicon Based System-in-Package : Breakthroughs in Miniaturization and 'Nano'-Integration Supported by Very High Quality Passives and System Level Design Tools

摘要

The very large development of home and domestic electronic appliances as well as portable devices has led the microelectronics industry to evolve in two complementary directions: "More Moore" with the continuous race towards extremely small dimensions, hence the development of SoCs (System on Chip) and more recently a new direction that we could name "More than Moore" with the integration of devices that were laying outside the chips and here the creation of SiPs (System in Package).