首页> 外文会议>Materials Research Society Symposium >Direct formation of C54 phase on the basis of C40 TiSi_2 and its applications in deep sub-micron technology
【24h】

Direct formation of C54 phase on the basis of C40 TiSi_2 and its applications in deep sub-micron technology

机译:基于C40 TISI_2的C40 TISI_2直接形成C54相位,并在深亚微米技术中的应用

获取原文

摘要

A simple and novel salicidation process applying pulsed laser annealing as the first annealing step was used to induce TiSi_2 formation.Both Raman spectroscopy and transmission electron microscope results confirm the formation of a new phase of Ti dislicide,the pure C40 TiSi_2 after laser irradiation.Direct C54 phase growth on the basis of C40 template bypassing the C49 phase is accomplished at the second annealing temperature as low as 600degC.Line width independent formation of the C54 phase was observed on patterned wafers using this salicidation process and "fine line effect" is eliminated.
机译:应用脉冲激光退火作为第一退火步骤的简单且新的PAticativation工艺用于诱导TISI_2形成。从raman光谱和透射电子显微镜结果证实,在激光照射后纯C40 TISI_2的新阶段的形成.Direct C40模板的基础上C40模板的基础上C40期间在第二退火温度下完成,低至600degc.Line宽度,在使用该PATICATID过程的图案化晶片上观察到C54相的宽度形成,并消除了“细线效应” 。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号