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Corrosion studies of metallic finishes in electronics

机译:电子产品中金属饰面的腐蚀研究

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Substrates like brass, copper, steel, and zinc are generally plated with copper, and nickel Nickel under-layer provides a diffusion barrier. Depending on the application, coatings of Pd, Pd-Ni, Pd-Co, Au-Co, Sn, and Sn-Pb are applied on the surfaces as a final finish. This investigation assessed the corrosion behavior of some of these finishes in neutral sodium chloride and other selected electrolytes. With the aid of Linear Polarization and Tafel plots, corrosion rates in these mediums were estimated. Potentiodynamic polarization curves predict corrosion behavior under extreme oxidizing conditions. Corrosion characteristics and corrosion products were identified by Scanning Electron Microscopy (SEM), and by X-ray Diffraction methods. The corrosion products formed were compared with those formed under exposure to salt spray and mixed flowing gas. Probable mechanisms were postulated based on corrosion products. Electrochemical techniques are shown to provide a quick predictor of the behavior of electrofinishes in a corrosive environment and may be employed in assessing the quality of a given coating without undergoing long and laborious environmental testing.
机译:像黄铜,铜,钢和锌等衬底通常用铜镀,镍镍下层提供扩散屏障。根据应用,Pd,Pd-Ni,Pd-Co,Au-Co,Sn和Sn-Pb的涂层作为最终饰面施加在表面上。该研究评估了这些氯化钠和其他选择的电解质中一些饰面的腐蚀行为。借助线性极化和Tafel图,估计这些培养基中的腐蚀速率。电位动力学偏振曲线在极端氧化条件下预测腐蚀行为。通过扫描电子显微镜(SEM)和X射线衍射方法鉴定腐蚀特性和腐蚀产物。将形成的腐蚀产物与在暴露于盐雾和混合流动气体的下方形成的腐蚀产物。可能的机制基于腐蚀产物发布。示出了电化学技术,以提供腐蚀性环境中电催化行为的快速预测器,并且可以用于评估给定涂层的质量而不经历长期且艰苦的环境测试。

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