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2-D Fiber Bundle Array For An Optoelectronic System Based On OE-VLSI Chip

机译:基于OE-VLSI芯片的光电系统2-D光纤束阵列

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Over the past few years, with rapidly growing popularity of the Internet and the world wide web, the performance of microprocessors and capacity of switching model has been growing exponentially and this growth can be expected to continue in the foreseeable future.[1] To meet the demand of increasing performance and capacity for microprocessors and switching model, the silicon integrated circuits (IC's) has became increasingly sophisticated in terms of larger numbers of gates and high clock rates. For advanced processor chips, aggregate input and output I/O data rates will need to be higher than 1 Tbit/s and number of I/O ports will be more than 4000 within the next 5 years. Consequently it can be anticipated that the communication bandwidth and I/O ports for a single chip will become a serious communication bottleneck.
机译:在过去几年中,随着互联网的普及和万维网的普遍性,微处理器的性能和交换模型的能力呈指数增长,预计这一增长可以在可预见的未来继续继续。[1]为了满足微处理器和切换模型的性能和能力的需求,硅集成电路(IC)在更大数量的栅极和高时钟速率方面变得越来越复杂。对于先进的处理器芯片,聚合输入和输出I / O数据速率需要高于1 Tbit / s,并且在未来5年内,I / O端口的数量将超过4000。因此,可以预测单个芯片的通信带宽和I / O端口将成为一个严重的通信瓶颈。

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