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Practical limitations to indentation testing of thin films

机译:薄膜压痕测试的实际限制

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A method that is becoming increasingly common for measuring the mechanical behavior of thin films is low-load indentation testing. However, there can be complications in interpreting the results as many factors can affect hardness and moduli measurements such as surface roughness and determination of the indentation contact area. To further our understanding, the mechanical properties of thin (50 nm) films of AlN on sapphire substrates were evaluated using a scanning force microscopy (SFM) based pico-indentation device to allow imaging of the surface and indentations. Our primary emphasis was the types of problems or limitations involved in testing very thin, as deposited films in which properties are desired over indentation depths less than 50 nm.
机译:一种变得越来越普遍用于测量薄膜的机械行为的方法是低负载缩进测试。然而,在解释结果中可能存在并发症,因为许多因素可能影响诸如表面粗糙度和压痕接触区域的表面粗糙度和测定的硬度和模态测量。为了进一步了解,使用基于扫描力显微镜(SFM)的微微压痕装置评估了Sapphire底物上的AlN薄(50nm)膜的机械性质,以允许表面和压痕成像。我们的主要重点是测试非常薄的问题或限制的类型,如沉积的薄膜,其中在小于50nm的压痕深度上所需的性质。

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