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Doping mechanism in tetrahedral amorphous carbon

机译:四面体无定形碳中的掺杂机制

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Doping in hydrogenated amorphous silicon occurs by a process of an ionised donor atom partially compensated by a charged dangling bond. The total energies of various dopant and dopant/bonding combinations are calculated for tetrahedral amorphous carbon. It is found that charged dangling bonds are less favoured because of the stronger Coulombic repulsion in ta-C. Instead the dopants can be compensated by weak bond states in the lower gap associated with odd-membered pi -rings or odd-numbered pi -chains. The effect is that the doping efficiency is low but there are not charged midgap recombination centres, to reduce photoconductivity or photoluminescence with doping, as occurs in a-Si:H.
机译:通过通过带电悬空键部分补偿的电离供体原子的方法发生掺杂氢化非晶硅。为四面体无定形碳计算各种掺杂剂和掺杂剂/粘合组合的总能量。结果发现,由于TA-C中的库仑排斥力较强,所以带电的悬空键较小。相反,掺杂剂可以通过与奇数元Pi-rings或奇数Pi -chains相关的弱键状态来补偿弱键状态。效果是掺杂效率低,但没有充电的中间涂层重组中心,以减少光电导率或用掺杂的光致发光,如A-Si:h所发生的。

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