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Induction assisted laser-cladding a new and effective method for producing high wear resistant coatings on steel components

机译:感应辅助激光覆层一种在钢部件上生产高耐磨涂层的一种新的有效方法

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Despite better wear resistance two problems hinder the wide industrial application of lasercladding: 1) low cladding speeds and deposition rates; and 2) crack formation (within the clad when using heat treatable steels as base material and within brittle hard-facing alloys). To avoid these disadvantages, an additional power source, which is suitable for the laser-cladding process, is needed. The purpose of this additional power source is to reduce the temperature gradient within the clad and base material while cooling and to deliver supplementary inexpensive energy. Induction heating is a smart, easily adjusted and adaptable technique to address this need. The combination of induction preheating followed by laser-cladding, for example, makes it possible to coat high carbon steels (AISI 1043) such as cold work tool steels (AISI O2) with hard, wear resistant alloys (Nicrobor 40, Deloro 60). Although cracks within the clad can be avoided in every case, induction assisted laser-cladding allows the simultaneous generation of martensitic layers within the base material. This opens the possibility for laser-cladding and induction heat treatment in one step. Furthermore the cladding speed and the deposition rate can be increased by ten times over conventional laserbeam-cladding. As a result, production cost can be reduced despite higher technological expenditure. Nevertheless, the typical advantage of laser-cladding (namely, low dilution of base material into the clad material) is maintained.
机译:尽管耐磨性更好,但两个问题妨碍了LaserCladding的广泛工业应用:1)低包层速度和沉积速率; 2)裂缝形成(在包层内使用热处理钢作为基础材料,并且在脆性硬质合金中)。为了避免这些缺点,需要适用于激光包层工艺的额外电源。该额外电源的目的是在冷却时减小包层和基材内的温度梯度,并提供补充廉价能量。感应加热是一种智能,易于调整和适应性的技术,以解决这种需求。例如,通过激光包覆的感应预热之后的组合使得可以涂覆高碳钢(AISI 1043),例如冷轧工具钢(AISI O 2),具有硬,耐磨合金(Nicrobor 40,Deloro 60)。尽管在各种情况下,可以避免包层内的裂缝,但感应辅助激光包层允许同时在基材内产生马氏体层。这在一步中打开了激光包层和感应热处理的可能性。此外,在传统的Laserbeam - 包层上可以增加包层速度和沉积速率。因此,尽管技术支出更高,但生产成本可能会降低。然而,维持激光包层的典型优势(即,将基材的低稀释物稀释到包层中)。

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