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Electron Transfer at the n-InP poly(pyrrole) Interface

机译:电子转移在N-InP 聚(吡咯)界面

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Measurements of the barrier height by capacitance-voltage techniques and of the equilibrium exchange current density by current-voltage techniques are performed on the rectifying interface between n-InP and poly(pyrrole) (chemically polymerized and characterized by an electrochemical potential of =0.2V vs. SCE). The current-voltage data yielded a quality factor of 1.2 ± 0.1 and an equilibrium exchange current density of (1.2 ± 0.6) × 10~(-9) A cm~(-2). The capacitance-voltage data yielded a barrier height of 0.73 ± 0.02 V and measured dopant densities within 15% of the expected value. These data, taken together, are inconsistent with thermionic emission theories developed to describe inorganic semiconductor ) metal interfaces and often applied to inorganic semiconductor | doped conjugated polymer interfaces. In particular, the ratio of the rate constant for majority carrier electron capture (surface recombination velocity) at the n-InP | poly(pyrrole) interface to that at n-InP | metal interfaces is found to be (6 ± 5) × 10~(-3).
机译:通过电流 - 电压技术和通过电流 - 电压技术的平衡交换电流密度对屏障高度进行测量,对N-INP和聚(吡咯)(化学聚合并以= 0.2V的电化学电位为特征而进行化学聚合并表征vs. sce)。电流 - 电压数据产生1.2±0.1的质量因数,平衡交换电流密度(1.2±0.6)×10〜(-9)A cm〜(-2)。电容电压数据产生屏障高度为0.73±0.02 V,并测量掺杂剂密度范围内的预期值的15%。将这些数据在一起,与用于描述无机半导体)金属界面的恒温发射理论不一致,并且经常应用于无机半导体|掺杂的共轭聚合物界面。特别地,在N-InP上大多数载体电子捕获(表面复合速度)的速率常数的比率聚(吡咯)界面在N-InP |发现金属界面是(6±5)×10〜(-3)。

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