首页> 外文会议>World foundry congress on fonderie sans frontieres casting without borders giessen ohne grenzen >THE ADHESIVE HARDENING MECHANISM AND HYGROSCOPICITY-RESISTANT OF A-STARCH COMPOUND BINDER FOR DRY SAND MOLD (CORE)
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THE ADHESIVE HARDENING MECHANISM AND HYGROSCOPICITY-RESISTANT OF A-STARCH COMPOUND BINDER FOR DRY SAND MOLD (CORE)

机译:干砂模具(核心)的粘合剂固化机理及抗淀粉复合粘合剂的抗湿性

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The adhesive hardening mechanism and hygroscopicity-resistant of a-starch compound binder for dry sand mold (core) were studied by way of DSC, XRD, IR spectra analyses and SEM. It is thought that the bonding strength of molding sand is mainly depended on the strength of the adhesive membrane itself. While the binder is heated at certain temperature between 160°C -200°C for one hour, the reactions of condensation and condensation polymerization as well as esterification happen between silicon-hydroxyl groups (-SiOH) of sodium silicate, starch and sodium silicate, starch and phosphate respectively, thus, a three-dimensional skeleton mainly consisting of Si (silicon), O (oxygen) C (carbon), P (phosphorus) is formed. And kaolin grains adsorbing a layer of starch gum are well-distributed in the skeleton, therefore the binder is provided with higher low-temperature drying strength and better hygroscopicity-resistant. Because kaolin in the binder can react with sodium silicate and phosphate at high temperature separately, forming Al-O-Si three-dimensional skeleton and AIPO_4 correspondingly, the binder is also provided with higher high temperature-resistant strength.
机译:通过DSC,XRD,IR光谱分析和SEM研究了用于干砂模(核心)的粘合剂固化机理和抗干砂粘合剂的抗湿性抗性。据认为,模塑砂的粘合强度主要取决于粘合剂膜本身的强度。虽然粘合剂在160℃-200℃的特定温度下加热1小时,但在硅酸钠,淀粉和硅酸钠的硅 - 羟基(-SiOH)之间发生缩合和缩聚的反应以及酯化。因此,淀粉和磷酸盐分别形成了主要由Si(硅),O(氧)C(碳),P(磷)组成的三维骨架。并且吸附一层淀粉胶的高岭土晶粒在骨架中分布得很好,因此粘合剂具有更高的低温干燥强度和更好的吸湿性抗性。因为粘合剂中的高岭土可以在高温下分别与硅酸钠和磷酸盐反应,相应地形成Al-O-Si三维骨架和AIPO_4,粘合剂也具有更高的耐高温强度。

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