Bottom-up copper deposition in alkaline electrolytes

摘要

Superconformal electrodeposition enables the fabrication of high aspect ratio interconnects that are ubiquitous in microelectronics. The Curvature Enhanced Accelerator Coverage (CEAC) mechanism captures the morphological and kinetic aspects of many “superfilling” processes for Damascene interconnect fabrication [1–4]. Present superfilling copper electrolytes are acidic. Alkaline chemistries might rely on a non-CEAC filling mechanism.