Formation and relative stability of interstitial solid solutions at interfaces in metal matrix composites

摘要

On the example of Cu-C composite material the way to calculate the occupation of the interstitial positions and its temperature dependence is shown. The results obtained on the basis of non-empirical calculations indicate the preferable occupation of octahedral positions up to T～1200 K. This confirms the structure of the interstitial solid solution. Within this model the influence of the alloying on the height of the diffusion barrier and on the temperature dependence of carbon diffusion in copper is calculated.