Finite element simulation of optical interconnect (OIC) module

机译：光学互连（OIC）模块的有限元仿真

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An optical interconnected transmit-receive module has been simulated utilizing finite element analysis, and its thermal-mechanical response to a 5g uni-directional load has been determined. The interconnects of flip chip solder bumps are shown tobe the location of maximum stress concentration. The calculated maximum shear stresses are less than 1000 KPa.

机译：已经利用有限元分析模拟了光学互连的发射接收模块，并且已经确定了其对5G单向负载的热机械响应。倒装芯片焊料凸块的互连显示为最大应力浓度的位置。计算的最大剪切应力小于1000kPa。

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《Pacific Rim/ASME international intersociety electronic photonic packaging conference》|1997年||共7页
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Nickolaos Strifas; Aris Christou;
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中图分类封装及散热问题;
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4. Finite Element Simulation of Optical Interconnect (OIC) Module [C] . Nickolaos Strifas, Aris Christou Pacific Rim/ASME international intersociety electronic photonic packaging conference;INTERpack'97 . 1997

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5. Optical computing using interference filters as nonlinear optical logic gates and holographic optical elements as optical interconnects. [D] . Wang, Lon A. 1988

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Finite element simulation of optical interconnect (OIC) module

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