Mechanical properties of thin (< 14μm) films are difficult to measure reliably. Thus, stress modeling often relics on values obtained on thick films. A simple method is presented that allows reliable measurement of the Young's modulus of thinfilms using a Thermal Mechanical Analyzer. With the same instrument and on the same sample the linear coefficient of thermal expansion (CTE) of thin films can be measured. The latter method involves applying a constant load to the sample. This leads tocreep. Reliable CTE values can be obtained only after creep has come to an equilibrium. The optimal conditions for both measurements are described, and the methods are demonstrated on 0.5 mil Kapton film which was characterized by refractive indexmeasurements.
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机译：薄（<14μm）薄膜的机械性能难以可靠地测量。因此，压力建模通常在厚膜上获得的值遗言。提出了一种简单的方法，其允许使用热机械分析仪可靠地测量杨氏模量的杨氏模量。使用相同的仪器和在相同的样品上，可以测量薄膜的热膨胀（CTE）的线性系数。后一种方法涉及将恒定负载施加到样品。这导致了难题。只有在蠕变到达平衡后，才能获得可靠的CTE值。描述了两种测量的最佳条件，并在0.5 mil Kapton膜上证明了该方法，其特征在于折射率。
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