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Function testing and failure analysis of integrated circuit chip using laser probe

机译:激光探头集成电路芯片功能测试与故障分析

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Introduced the construction of the experiment system of the laser probe measurements based on electro-optic sampling technique. Analyzed the relationship between the width of the optical pulses and the signal noise ratio of detection. The function of different stage circuit internal to the high-speed dynamic divider circuit chip have been measured with the double-frequency phase sweeping technique. A detail analysis about the chip failure have been given.
机译:基于电光采样技术介绍了激光探头测量实验系统的构建。分析了光脉冲宽度与检测信号噪声比之间的关系。用双频相位清扫技术测量了不同级电路内部到高速动态分频器电路芯片的功能。已经给出了关于芯片故障的详细分析。

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