Innovative thin film deposition technologies enabling new materials and new device integration roadmaps

摘要

Innovative thin film deposition technologies play a key role in new device scaling strategies that are increasingly based on the use of new materials and 3D approaches. Smart tailor-made equipment solutions have enabled processes that were previously considered impossible for volume manufacturing. Examples of atomic layer deposition and epitaxy techniques for logic and memory devices will be presented as well as spin-offs to applications in solar cells and hard disks.