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A 3-D kinematic model of complex chip curling with chip breaker tools in metal cutting. part I: analytical modelling

机译:金属切削碎片破碎机复合芯片卷曲三维运动学模型。第一部分:分析建模

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It has been realised that the analytical model of 3-D chip curling plays a central role in the chip formation that would predict the chip forms/shapes efficiently for the aim of chip control. The purpose of the two-part paper is to investigate and model the 3-D chip curling processes in theory. In part I, an analytical modelling procedure is described in detail and a general mathematical model for predicting chip forms/shapes in 3-D cutting processes with complex chip breaker tools is presented onthe basis of three basic chip curling patterns, i.e. up-curl, side-curl and twisting. In part II, the theoretical analysis and discussion have been done systematically based on the model presented. Therefore a group of criterions for the effects of threechip angular velocity componentsω{sub}x,ω{sub}y,ω{sub}z and chip flow angleη{sub}0 on the chip forms/shapes is derived. The varying tendency of the chip radius and chip pitch with varying ω{sub}x,ω{sub}y,ω{sub}z and η{sub}0 is discussed based onthe group of criterions. For better understanding, a group of 3-D diagrams is given to visualize the varying tendency of chip geometry. The 3-D analytical model and the group of criterions presented in part I and part II of the paper reveal new insightsin to the nature of chip curling in 3-D machining in theory and are significant for the analytical prediction of the chip curling and the chip breaking, as well as the geometric design of the chip breaker/groove.
机译:已经意识到,3-D芯片卷曲的分析模型在芯片形成中起着核心作用,该芯片形成将有效地预测芯片形式/形状以芯片控制的目的。两部分纸的目的是研究和模拟理论上的三维芯片卷曲过程。在第一部分中,详细描述了分析建模程序,并且在三个基本芯片卷曲图案的基础上,提出了一种用于预测与复杂的芯片断路器工具的3-D切割过程中的芯片形式/形状的一般数学模型。侧面卷曲和扭曲。在第二部分,基于所提供的模型来系统地完成了理论分析和讨论。因此,导出了一组关于芯片形式/形状上的Threcepip角速度分量ω{sub} x,ω×y,ω{sub} y,ω{sub} y,ω{sub} z和芯片流量角度θ0的效果。基于一组标准,讨论了芯片半径和芯片间距的变化趋势和芯片距和芯片间距的变化ω{Sub} x,ω{sub}yΩ·z和η{sub} 0。为了更好地理解,给出了一组三维图来可视化芯片几何形状的变化趋势。 3-D分析模型和本文第I部分和第II部分中提出的标准组揭示了新的Insightsin在理论上的3-D加工中的芯片卷曲性质,对芯片卷曲的分析预测具有重要意义芯片破碎,以及碎屑破碎机/凹槽的几何设计。

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