首页> 外文会议>ASME International Mechanical Engineering Congress and Exposition >ELECTRODEPOSITION IN POLYMERIC MICROMOLDS FOR THE FABRICATION OF METALLIC MICROSTRUCTURES
【24h】

ELECTRODEPOSITION IN POLYMERIC MICROMOLDS FOR THE FABRICATION OF METALLIC MICROSTRUCTURES

机译:用于制备金属微结构的聚合物微胶中的电沉积

获取原文

摘要

Electrodeposition in micromolds is an important step in processes such as LIGA, an acronym from the German words for lithography, electroforming and molding, for fabricating metallic microstructures. This paper investigates electrodepo sition in sacrificial polymeric micromolds with a conducting base and plastic features that provide insulating sidewalls for electrodeposition of the desired metallic micropart. Computa tional models for the governing transport and electrochemical phenomena are used to simulate the evolution of the electro deposition front. The effects of the applied voltage and mi-cromold geometry are systematically studied for their influ ence on the resulting electrodeposition rate and the homogene ity of the fabricated microparts. Conditions that lead to desira ble process and part quality are derived from the studies.
机译:微胶体中的电沉积是诸如LIGA的过程中的重要步骤,从德国单词,用于光刻,电铸和成型的常规,用于制造金属微观结构。本文研究了具有导电基底和塑料特征的牺牲聚合物微胶中的电源,用于为所需金属微珠的电沉积提供绝缘侧壁。用于控制传输和电化学现象的计算模型用于模拟电沉积前沿的演变。施加电压和Mi-Cromold几何的效果被系统地研究其对所得电沉积速率和制造的微粉的同源Ity的影响。导致Desira BLE进程和部分质量的条件来自研究。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号