Transient heat conduction and thermal stress analysis of laminated composite materials are very important because they are heated during manufacturing process. Anisotropy of thermal conductivity has to be considered for heat conduction analysis of composite materials such as FRP. Assuming that heat conducts uniformly in normal direction in thin structures, laminated plates can be modeled as single layers with the equivalent heat conductivities. With this assumption, FEM three dimensional transient heat conduction and thermal stress analysis programs for laminated composite materials are developed. As numerical examples, the heat conduction and thermal stresses of laminated CFRP structures are investigated.
展开▼
