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MODELING AND INVERSE DESIGN OF CONVECTIVE HEAT TRANSFER IN A GROOVED CHANNEL USING PROPER ORTHOGONAL DECOMPOSITION

机译:使用适当的正交分解在沟槽通道中对流传热的建模与逆设计

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In this study we show that the POD can be used as a useful tool to solve inverse design problems in thermofluids. In this respect, we consider a forced convection problem of air flow in a grooved channel with periodically mounted constant heat-flux heat sources. It represents a cooling problem in electronic equipments where the coolant is air. The cooling of electronic equipments with constant periodic heat sources is an important problem in the industry such that the maximum operating temperature must be kept below a value specified by the manufacturer. Geometric design in conjunction with the improved convective heat transfer characteristics is important to achieve an effective cooling. We obtain a model based on the proper orthogonal decomposition for the convection optimization problem such that for a given channel geometry and heat flux on the chip surface, we search for the minimum Reynolds number (i.e., inlet flow speed) for a specified maximum surface temperature. For a given geometry (l = 3.0 cm and h = 2.3 cm), we obtain a proper orthogonal decomposition (POD) model for the flow and heat transfer for Reynolds number in the range 1 and 230. It is shown that the POD model can accurately predict the flow and temperature field for off-design conditions and can be used effectively for inverse design problems.
机译:在这项研究中,我们表明POD可以用作解决Thermof流体中的逆设计问题的有用工具。在这方面,我们考虑带槽通道中的空气流动的强制对流问题,其具有周期性地安装的恒定热通量热源。它代表了冷却剂是空气的电子设备中的冷却问题。具有恒定周期性热源的电子设备的冷却是行业中的重要问题,使得最大工作温度必须保持低于制造商指定的值。几何设计与改善的对流传热特性相结合是实现有效冷却的重要性。我们基于对对流优化问题的适当正交分解获得一个模型,使得对于芯片表面上给定的信道几何和热通量,我们搜索指定的最大表面温度的最小雷诺数(即,入口流速) 。对于给定的几何形状(L = 3.0cm和H = 2.3cm),我们获得适当的正交分解(POD)模型,用于在1和230中的雷诺数的雷诺数的流动和传热。结果显示了POD模型可以精确地预测用于非设计条件的流动和温度场,可以有效地用于逆设计问题。

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