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Sequential screening in semiconductor manufacturing: exploiting lot-to-lot variability and spatial dependence

机译:半导体制造中的顺序筛选:利用批量变异性和空间依赖性

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摘要

Summary form only given. Screening at the wafer level to exploit lot-to-lot variability is considered. The yield is modeled using an empirical Bayes framework: the number of bad chips on each wafer in a given lot is a gamma random variable, and the scale parameter is unknown and varies from lot to lot according to another gamma distribution. The resulting problem is an optimal stopping problem embedded within a mathematical program, and the optimal solution is determined numerically. Screening at the chip level to exploit various dependencies is discussed, and a variety of chip screening policies are identified. A predictive performance analysis is undertaken to estimate the appropriate start rate of wafers for some of these policies. Both yield models are fitted to industrial data from several different facilities, and the proposed and derived policies are tested on the actual data. It is found that significant increases in throughput, can be obtained. Chip screening policies that effectively exploit the various yield dependencies to distinguish between good and bad chips are identified.
机译:摘要表格仅给出。考虑了晶圆水平的筛选以利用批次批量变异性。使用经验贝叶斯框架进行建模的产量:给定批次中每个晶片上的坏芯片的数量是伽马随机变量,并且根据另一个伽马分布,缩放参数未知数。由此产生的问题是嵌入在数学程序中的最佳停止问题,并且最佳解决方案是在数字上确定的。讨论了芯片级以利用各种依赖性的筛选,并且识别各种芯片筛选策略。采取预测性能分析以估计一些这些政策的晶片的适当起始速率。两个产量模型都适用于来自几种不同的设施的工业数据,并且在实际数据上测试了提议和派生的政策。发现可以获得吞吐量的显着增加。识别有效利用各种产量依赖性来区分良好和坏筹码的芯片筛选策略。

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