首页> 外文会议>International Conference on Reversible Computation >Simulation of Base Excision Repair in the Calculus of Covalent Bonding
【24h】

Simulation of Base Excision Repair in the Calculus of Covalent Bonding

机译:共价粘接微积分基础切除修复的仿真

获取原文

摘要

In previous papers we have introduced a new process calculus inspired by chemical reactions, called the Calculus of Covalent Bonding. The key feature of the calculus was a new prefix operator of the form (s;b), where doing of action b triggers undoing of one of the actions in s. Because of this connection between doing and undoing of actions (or forming and breaking of bonds in a chemical modelling) we called this local reversibility. We have shown that our calculus enables out-of-causal order reversibility. In this paper we demonstrate the Base Excision Repair of DNA, a high-level biological example, using our calculus. We also introduce a software which allows us to check the syntax of processes and to simulate their execution.
机译:在先前的论文中,我们引入了通过化学反应的启发的新工艺考核,称为共价键合的微积分。微积分的关键特征是表单的新前缀运算符(S; B),其中执行Action B触发■在S中的一个行动撤消。由于这种联系,在做和撤消的动作(或在化学建模中的形成和破坏键)之间,我们称之为本地可逆性。我们已经表明,我们的微积分使得失控的失控性能够失控。在本文中,我们证明了DNA的基础切除修复,使用我们的微积分,高级生物实例。我们还介绍了一种软件,该软件允许我们检查流程的语法并模拟其执行。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号