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Microstructural Change and Fracture Behavior under Different Heat Exposure Conditions on Thermal Barrier Coatings Deposited on TiAl Intermetallic Compound

机译:在Tial金属间化合物沉积的热阻挡涂层不同热暴露条件下的微观结构变化和断裂行为

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Air plasma sprayed thermal barrier coatings (APS-TBCs) deposited on the TiAl intermetallic compounds was heat exposed in air at different temperatures and times to evaluate the microstructural change and delamination behavior. The thermal barrier coating (TBC) layer, bond coat (BC) layer and substrate were composed of 4 mol% Y2O3 stabilized ZrO_2, CoNiCrAlY alloy (Co-32Ni-21Cr-8Al-0.5Y (mol%)) and TiAl intermetallic compound (Ti-46Al-7Nb-0.7Cr-0.2Ni-0.1 Si (mol%)), respectively. Due to the heat exposure, diffusion of the elements occurred between the BC layer and the substrate, and diffusion layers were formed on both the BC layer and the substrate. A thermally grown oxide (TGO) layer was formed between the TBC layer and the BC layer. The thickness of the TGO layer and the diffusion layer increased with increasing exposure temperature and time. In the TBCs heat exposed at 1273 K for 200 h, a composite oxide of Al_2O_3 and TiO_2 was formed in the BC layer. Regarding the TBCs which were as-deposited and heat exposed at 1073, 1173 K up to 200 h and at 1273 K for 10 h, delamination occurred in the TBC layer near the BC layer. In the TBCs exposed at 1273 K for 50 h or more, delamination occurred at the vicinity of the interface between diffusion layer on the substrate side and the unreacted side of the substrate too. In case that the TBCs were heat exposed at 1073 and 1173 K, the shear strength decreases after reaching the maximum value of the shear strength at 10 h heat exposure. When the TBCs were exposed to heat at 1273 K, the shear strength indicated a constant value after the shear strength increased up to 50 h. This change may be due to the change in crack path after exposure for 50 h at 1273 K.
机译:沉积在Tial金属间化合物上的空气等离子体喷涂的热阻挡涂层(APS-TBC)在空气中在不同温度下暴露在空气中,以评估微观结构变化和分层行为。热阻挡涂层(TBC)层,粘合涂层(BC)层和基材由4mol%的Y 2 O 3稳定化ZrO_2,同色合金(Co-32Ni-21cr-8Al-0.5Y(Mol%))和Tial金属间化合物( Ti-46Al-7NB-0.7Cr-0.2Ni-0.1 Si(Mol%))。由于热曝光,在BC层和基板之间发生元件的扩散,并且在BC层和基板上形成扩散层。在TBC层和BC层之间形成热生长的氧化物(TGO)层。随着曝光温度和时间的增加,TGO层和扩散层的厚度增加。在TBCS在1273K下暴露于200小时的TBC,在BC层中形成Al_2O_3和TiO_2的复合氧化物。关于在1073,1173k的沉积和热暴露的TBC,高达200小时和1273k,在1273k℃下暴露10小时,在BC层附近的TBC层中发生分层。在暴露于1273k的TBC中,50小时或更长,在基板侧的扩散层之间的界面和基板的未反应侧的界面附近发生分层。在1073和1173k下暴露的TBC被暴露的情况下,在达到10小时热暴露时达到剪切强度的最大值后,剪切强度降低。当TBC在1273 k下暴露在加热时,剪切强度在剪切强度增加至50小时后表示恒定值。这种变化可能是由于1273k暴露50小时后裂纹路径的变化。

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