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An experimental study on thermal contact conductance across the SS316L/CuCrZr interface

机译:SS316L / CUCRZR接口热接触电导的实验研究

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A vacuum apparatus to measure thermal contact conductance(TCC)was introduced.A TCC test method and procedure was presented.By monitoring the temperature distribution on the test specimen,the heat flux and temperature drop of the contact interface were calculated,and then the TCC was obtained.The experimental research was conducted with pressed pairs SS316L/CuCrZr contacts in a range of 100~300°C and 1~10MP.The experimental data analysis results show that the TCC increases with the increase of contact temperature and the TCC also grows with the growth of contact pressure.The TCC appears as a linear relationship with the change trend of pressure at a given temperature.By uncertainty analysis,the measurement error of TCC decreases with the increase of contact pressure at a given temperature.And the variation rate of measurement error increases with the rise in contact temperature.
机译:介绍了一种测量热接触电导(TCC)的真空装置。提出了TCC测试方法和程序。通过监测试样上的温度分布,计算接触界面的热通量和温度降,然后TCC得到了100〜300°C和1〜10MP的压制对SS316L / CUCRZR触点进行了实验研究。实验数据分析结果表明,随着接触温度的增加,TCC也增长了TCC随着接触压力的增长。TCC与给定温度下的压力变化趋势看起来是线性关系。不确定性分析,TCC的测量误差随着给定温度的接触压力的增加而降低。变化率测量误差随着接触温度的上升而增加。

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