The research presented in this article was focused on proving the effect of wood chips parameters on the hardening process of silicate matrix in cement-bonded particleboard. Namely content of humidity in the chips (in range 30 to 90%) was significant. This amount of humidity was chosen with respect to real conditions of cement-bonded particleboards production. Influence of humidity could be reflected in the content of sugar (cellulose etc.) in wooden chips. The sugars affect the hardening of matrix negatively. Thus, phase composition and microstructure of matrix of cement-bonded particle boards were analysed during 2 to 28 days. Investigation of physico-chemical parameters and microstructure was also supplemented by verification of the basic material characteristics of cement-bonded particleboards (strength and modulus of elasticity in bending, transverse tensile strength perpendicular to the plane of the board, etc.). Slightly negative effect of increasing chip humidity content on the mineralogical composition and microstructure including physical parameters was shown in scope of the experiments. Therefore attention during cement-bonded particleboards production has to be paid even to moisture of the chips.
展开▼
