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Leveraging CPU Electromagnetic Emanations for Voltage Noise Characterization

机译:利用CPU电磁散射用于电压噪声表征

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Worst-case dI/dt voltage noise is typically characterized post-silicon using direct voltage measurements through either on-package measurement points or on-chip dedicated circuitry. These approaches consume expensive pad resources or suffer from design-time and run-time overheads. This work proposes an alternative non-intrusive, zero-overhead approach for post-silicon dI/dt voltage noise generation based on sensing CPU electromagnetic emanations using an antenna and a spectrum analyzer. The approach is based on the observation that high amplitude electromagnetic emanations are correlated with high voltage noise. We leverage this observation to automatically generate voltage noise (dI/dt) stress tests with a genetic-algorithm that is driven by electromagnetic signal amplitude and to obtain the first-order resonance-frequency of the Power-Delivery LC-tank network. The generality of the approach is established by successfully applying it to three different CPUs: two ARM multi-core mobile CPU clusters hosted on a big.LITTLE configuration and an ×86-64 AMD desktop CPU. The efficacy of the proposed methodology is validated through VMIN and direct voltage noise measurements.
机译:最坏的情况下,DI / DT电压噪声通常使用直接电压测量通过封装测量点或片上专用电路来表征后硅后硅。这些方法消耗昂贵的焊盘资源或遭受设计 - 时间和运行时开销。该工作提出了一种基于使用天线和频谱分析仪的CPU电磁散发的硅片二级/ DT电压发电的替代非侵入式零开销方法。该方法基于观察到,高幅度电磁散发与高压噪声相关。我们利用这种观察来自动产生电压噪声(DI / DT)应力测试,该遗传算法由电磁信号幅度驱动并获得电力输送LC罐网络的一阶谐振频率。通过成功将其应用于三种不同的CPU:托管在大型配置和×86-64AMD桌面CPU上的两个ARM多核移动CPU集群来建立该方法的一般性。通过Vmin和直接电压噪声测量验证了所提出的方法的功效。

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