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End milling as a surface pretreatment for adhesive bonding of CFRP - new approaches for root cause identification of reduced bond line performance

机译:作为CFRP粘合剂粘接的表面预处理的终端铣削 - 新方法的根本原因识别减少债券线性能

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End milling is an interesting technology for the surface preparation of bonded joints of carbon fiber reinforced polymer (CFRP) for manufacturing and repair. It can be automated and therefore allows, in theory, a bondline pretreatment with reproducible surface characteristics. However, the mechanical cutting process of milling in microscale is not fully understood yet. Adhesive joints from milled CFRP surfaces often entail lower strength compared to sanding. In the work presented, the authors propose a new approach for investigations of drivers for the known, negative phenomena of end milling CFRP surface pretreatment, such as hard-to-remove micro particle layers on the surface or micro damages in the surface-near material. The approach uses a combination of cutting simulation in combination with a newly developed chip root investigation technique. The simulation focuses on microscale modeling of the material and the incorporation of strain rate-dependent behavior of the matrix material. The chip root investigations do not rely on simplification of the cutting mechanism, but use the actual end milling process. Chip roots are analyzed using field emission scanning electron microscopy (FE-SEM) in combination with a special cross-section preparation technique. The combined results lead to a better understanding of the material behavior during mechanical pretreatment. It can be used for process optimization.
机译:端铣是用于制造和修复的碳纤维增强聚合物(CFRP)的粘结关节表面制备的有趣技术。它可以自动化,因此可以理解,具有可再现的表面特性的键合预处理。然而,液体中研磨的机械切削过程尚未完全理解。与砂光相比,来自碾磨CFRP表面的粘合剂往往需要更低的强度。作者提出了一种新的方法,用于调查用于最新的铣削CFRP表面预处理的已知负现象的驾驶员,例如难以去除表面或微颗粒在表面近材料中的微颗粒层。该方法使用切割模拟的组合与新开发的芯片根部调查技术相结合。仿真侧重于材料的微观建模和掺入基质材料的应变率依赖性行为。芯片根系调查不依赖于切割机构的简化,但使用实际的端铣过程。使用现场发射扫描电子显微镜(Fe-SEM)与特殊的横截面制备技术进行分析芯片根。合并的结果导致机械预处理期间更好地了解材料行为。它可用于处理优化。

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