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Tin sulphide prepared by sulphurisation process using metallic tin film precursor obtained from dc magnetron sputtering method

机译:采用从DC磁控溅射法获得的金属锡膜前体通过硫化工艺制备的硫化物

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Thin films of tin sulphide were prepared by sulphurisation process of metallic Sn precursor at temperature of 300-500°C in excess ambient of sulphur using a graphite box in N2 atmosphere. Sulphurisation temperature at 300°C, the films were formed in SnS phase with orthorhombic structure. In contrast, the films were formed in SnS2 phase with hexagonal structure when sulphurisation temperature higher than 300°C. From absorption spectra, direct band gap increased from 1.70 to 2.45 eV with increasing sulphurisation temperature. From the transient photoconductivity measurements, persistent photoconductivity behavior was observed in the films sulphurised at 300 and 350°C. The decay current data are better fitted with multiple exponential function resulting in the several slow decay times. Density of trap states corresponding to its decay time was also evaluated from the decay current data.
机译:通过N 2气氛中的石墨盒在300-500℃的温度范围为300-500℃的温度下,在300-500℃的温度下,在300-500℃的温度下的硫化物中,制备硫化薄膜。硫化温度在300℃下,用正交结构在SnS相中形成薄膜。相反,当硫化温度高于300℃时,在SNS2相中在SNS2相中形成膜。从吸收光谱,随着硫化温度的增加,直接带隙从1.70增加到2.45eV。从瞬态光电导测测量,在300和350℃下硫化的薄膜中观察到持续光电导性能。衰减电流数据更好地配备多个指数函数,从而导致几次缓慢衰减时间。还从衰减电流数据评估了与其衰减时间相对应的陷阱状态的密度。

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