Design and Fabrication of Sensor Chip with Heater for Semiconductor Flip-Chip Package Application

摘要

A heat generated from semiconductor chips and chip packages is considered a critical issue for high-performance and reliable device operation. In this paper we demonstrate a simple semiconductor chip with both heat generation and temperature sensor functions. By evaluating the relationship between the temperature of the chip and the resistance of the sensor, the thermal properties of the semiconductor package material can be determined. The heat generation block and temperature sensor are made of aluminum lines, not active circuit, so manufacturing cost is low and the processes are simple.