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Grinding force and specific energy in plunge grinding of 20CrMnTi with monolayer brazed CBN wheel

机译:用单层钎焊CBN轮磨削20crmnti的磨削力和特定能量

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In this paper, plunge grinding experiment was conducted on 20CrMnTi with monolayer brazed cubic boron nitride (CBN) wheel. Surface integrity was evaluated through morphology observing and roughness testing. It is found that surface roughness Ra is lower than 0.8μm. Grinding forces were measured and the effects of process parameters (i.e. workpiece speed and depth of cut) on grinding forces were studied. The changing regulation of specific grinding energy with the increase of equivalent chip thickness was revealed. The result shows that both grinding force and specific energy are lower comparing with white fused alumina (WA) wheels. In general, monolayer brazed CBN wheels perform better in grinding of 20CrMnTi than WA wheels.
机译:本文用单层钎焊立方氮化物(CBN)轮进行了平面研磨实验。通过形态学观察和粗糙度测试评估表面完整性。发现表面粗糙度Ra低于0.8μm。测量研磨力并研究了研究参数(即工件速度和切割深度)对研磨力的影响。揭示了随着等效芯片厚度的增加而改变特定研磨能量的调节。结果表明,与白色熔融氧化铝(WA)轮相比,磨削力和特定能量较低。通常,单层钎焊的CBN车轮比Wa轮磨削更好地进行20crmnti。

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