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The novel sensitivity improved surface micromachined MEMS microphone with the center-hole membrane

机译:新型敏感性改进了表面微机械MEMS麦克风与中心孔膜

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We present a new capacitive type surface micromachined MEMS microphone with improved sensitivity and frequency response. In contrast to the bulk micromachined MEMS microphones, the surface MEMS microphone shows advantages of CMOS compatibility and no backside etching process [1]. However, the shallow back chamber depth and the small sensing gap of the surface MEMS microphone increase the air damping on the sensing membrane and reduce the overall sensitivity. In this paper, we proposed the center-hole membrane. The proposed center-hole on the sensing membrane reduces the air damping at the center and increases the membrane displacement. The fabricated surface MEMS microphone with center-hole membrane shows an improved sensitivity and frequency response. The displacement of center-hole membrane is increased to 168% for 500^m diameter membrane and 172% for 700um diameter membrane at 10 kHz, with an equivalent acoustic pressure of lPa and a bias of 6V.
机译:我们介绍了一种新型电容式表面微机械MEMS麦克风,具有改善的灵敏度和频率响应。与散装微机械MEMS麦克风相比,表面MEMS麦克风显示CMOS兼容性的优点,并且没有背面蚀刻工艺[1]。然而,浅层室深度和表面MEMS麦克风的小的感测差距增加了传感膜上的空气阻尼并降低了整体敏感性。在本文中,我们提出了中心孔膜。在传感膜上提出的中心孔减少了中心的空气阻尼,并增加了膜位移。具有中心孔膜的制造表面MEMS麦克风显示出改善的灵敏度和频率响应。中心孔膜的位移增加至500℃膜的168%,10 kHz的700um直径膜的172%增加,LPA等同的声压和6V的偏压。

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